Although it’s now known that the version being tested might have the most recent M2 and plenty of RAM, Apple’s first AR headset was previously said to have performance comparable to the M1.
Another Chipset to Handle Less Demanding Tasks Could Also Be Included in Apple’s Mixed Reality Headset
Mixed reality content processing and rendering should be possible with the M2, which calls for a very potent chip. Apple’s decision to use the M2 rather than the more powerful M1 Pro or M1 Max makes sense given that the M2 requires less power to function at its peak. As a result, the AR headset won’t require a sophisticated cooling system to keep the chip’s thermals under control, which would have added to its bulk.
Although the M2’s processing capacity might not be as high as that of the M1 Pro or M1 Max, it ought to be sufficient to handle mixed reality content. Additionally, Apple will reportedly use the base M2 in the AR headset, which could result in the device having an 8-core GPU rather than a 10-core one out of the box, according to Bloomberg’s Mark Gurman.

Apple’s mixed-reality headset is in a different location. I hope to see the M2 along with the Mac and iPad Pro. I’m informed that the most recent internal iterations of the gadget utilize a base M2 chip and 16 gigabytes of RAM. Also at WWDC, there were a lot of software-related hints about realityOS, the operating system for the headset, and its features.
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The head-mounted wearable should have no trouble loading high-resolution images and textures thanks to the 16GB RAM, although Gurman did not confirm whether the 10-core GPU version of the AR headset will also be available. Since the M2 is allegedly included in its internals and the memory supports the LPDDR5 standard, we like to think that Apple will use unified RAM for its mixed reality headset.
This improvement will make the LPDDR5 standard function better and allow textures, images, and other assets to load a lot quicker. One mass-produced on the 4nm node and the other on the 5nm architecture are the two chipsets that Apple is rumored to use in its upcoming augmented reality headset. Since the M2 will carry the majority of the processing load and is already manufactured using TSMC’s second-generation 5nm process, the second silicon produced using the 4nm process could be utilized for computations about sensors.
Software bugs and overheating are two common problems that have been reported with Apple’s augmented reality headset in the past. It has undoubtedly been difficult for Apple to strike a nearly perfect balance between weight, performance, and power efficiency to keep the headset’s rumored weight below 150 grams while also being able to support a 96W charger like the 2021 redesigned MacBook Pro models.
Apple may have delayed the release of the AR headset until 2023 as a result of the many challenges, but from what we can see inside, the final product appears promising.
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VIA: wccftech