In China, Honor is preparing to launch the Magic 3 series. On August 12, the company is expected to release its flagship series. George Zhao, Honor’s CEO, recently teased the device’s back panel. The phone is said to have five camera sensors on the back. On the back, there are cutouts for the microphone, LED flash, and other components. The device’s other features have yet to be officially confirmed. The Magic 3 series phone has visited the Geekbench website ahead of its launch. Some key details about the upcoming Honor smartphone are revealed in the listing. Let’s take a look at the Honor Magic 3 series specs, features, and other information that has surfaced thanks to Geekbench.
Honor Magic 3 series listed on Geekbench
On August 12, Honor is expected to reveal the Magic 3 series. The phone is listed on the Geekbench website ahead of its release. The device will be powered by a Qualcomm Snapdragon 888 Plus SoC, according to the Geekbench listing. The ‘Plus’ variant receives two significant performance boosts. The prime core CPU on the SoC is increased to 2.995GHz, up from 2.84GHz on the SD888 SoC. It also has a 20% boost in AI performance compared to the SD888 SoC. The Adreno 660 GPU is paired with the processor.
The model number for the device listed on Geekbench 4 is ELZ-AN10. It has 8GB of RAM according to the benchmark website. The device comes pre-installed with Android 11. Honor’s custom Android skin is likely to be on top.
The device’s single-core and multi-core test scores are also revealed in the Geekbench 4 listing. Geekbench test scores were 3556 and 10257, respectively.
The device’s design renders had previously been leaked. It revealed that the phone has a curved display and will most likely support refresh rates of 90Hz or 120Hz. The front camera sensors will be housed in a pill-shaped hole punch cutout.
This concludes our coverage of the upcoming Honor phones. We’ll provide more information as it becomes available. How do you feel about the new Honor flagship phones? Please share your thoughts in the comments section below.